Gold finger of circuit board and fabricating method thereof
AssigneeNanya Technology Corporation
InventorsTsu-Shun Huang, Han-Ning Pei
Life of this patent
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Abstract
A method for fabricating a gold finger of a circuit board is provided. First, a circuit board having a board edge for cutting is provided. Next, a copper conducting wire pattern is formed on the circuit board. The copper conducting wire pattern includes a plurality of gold finger bodies and a plurality of tie bars. Each tie bar is connected to a corresponding gold finger body, and the tie bars are disposed across the board edge. Thereafter, a surface of each gold finger body is plated with gold, and the tie bars on the board edge are removed by etching. Because the tie bars on the board edge are removed, tear resistance of the gold finger is maintained after cutting the board edge.
Claims12
A method for fabricating gold finger of a circuit board, comprising:
- providing a circuit board having a board edge for cutting;
- forming a copper conducting wire pattern on the circuit board, wherein the copper conducting wire pattern comprises a plurality of gold finger bodies and a plurality of tie bars, and each tie bar is connected to a corresponding gold finger body and the tie bars are disposed across the board edge;
- plating a surface of the gold finger bodies with gold;
- and
- performing an etching process to remove the tie bars on the board edge.
A gold finger of a circuit board, comprising:
- a gold finger body, disposed on a circuit board, wherein a surface of the gold finger body is plated with gold;
- and
- a tie bar, connected to the gold finger body, wherein the tie bar is separated from a board edge of the circuit board by a distance.
Dependencies are inferred from the claim text.