US 2009/0020315 A1 · AUTOMATED DIRECT EMULSION PROCESS FOR MAKING PRINTED CIRCUITS AND MULTILAYER PRINTED CIRCUITS

Abstract

A method for making multilayer printed circuits includes a) coating a non-metallized substrate with a solution which creates a light sensitive surface on the substrate, b) imaging the coated substrate with a circuit design, c) developing the imaged substrate, d) directly plating the developed image onto the coated substrate, e) coating the plated substrate with a liquid photoimageable cover coat, f) imaging the coated plated substrate with a predesigned circuitry, g) developing the liquid photoimageable cover coat, and repeating steps a) through d). Steps e) through g) are then repeated followed by steps a) through d) until a desired number of layers is achieved for the multilayer circuit. The method may be automated by having a conveyer like system which automatically unrolls and directs a roll of non-metallized substrate through various coating, imaging, developing, and plating stations.

Claims26

Dependent claims

A method for making a multilayer printed circuit comprising the steps of:

a) coating a non-metallized substrate with a solution which creates a light sensitive surface on the substrate;
b) imaging the coated substrate with a predesigned circuitry by exposing the surface of the coated substrate to a light source;
c) developing the imaged substrate with one or more chemistries;
d) directly plating the developed image onto the substrate;
e) coating the plated substrate with a liquid photoimageable cover coat;
f) imaging the coated plated substrate with a predesigned circuitry by exposing the surface of the coated plated substrate to a light source;
g) developing the liquid photoimageable cover coat;
and
h) repeating steps a) through d).

6 more elements

An automated method for making a multilayer printed circuit comprising the steps of:

a) providing a roll of non-metallized substrate which is automatically unrolled and directed through a number of coating, imaging, developing and plating stations;
b) coating at least one of a top surface and bottom surface of the non-metallized substrate with a solution which creates a light sensitive surface on the substrate in a first coating station;
c) imaging at least one of a top and bottom surface of the coated substrate with at least one predesigned circuitry by exposing at least one of the top and bottom surfaces of the coated substrate to a light source in a first imaging station;
d) developing at least one of a top and bottom surface of the imaged substrate with one or more chemistries in a first developing station;
e) directly plating at least one of a top and bottom surface of the developed image onto the substrate in a first plating station;
f) coating at least one of a top and bottom surface of the plated substrate with a liquid photoimageable cover coat in a second coating station;
g) imaging at least one of a top and bottom surface of the coated plated substrate with at least one predesigned circuitry by exposing at least one of the top and bottom surfaces of the coated plated substrate to a light source in a second imaging station;
h) developing at least one of a top and bottom surface of the imaged liquid photoimageable cover coat in a second developing station;
and
i) coating at least one of a top and bottom surface of the developed liquid photoimageable cover coat image with the solution in the first coating station;
and
j) repeating steps c) through e).

9 more elements

Dependencies are inferred from the claim text.

Automated direct emulsion process for making printed circuits and multilayer printed circuits

Life of this patent

Automated direct emulsion process for making printed circuits and multilayer printed circuits

Life of this patent

Abstract

Claims26