Direct emulsion process for making printed circuits
AssigneeVectraOne Technologies, LLC
InventorSteven Lee Dutton
Life of this patent
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Abstract
A direct emulsion process for making printed circuits and printed circuit boards which includes coating a non-metallized substrate with a solution which creates a light sensitive surface on the substrate, imaging the coated substrate with a circuit design, developing the imaged substrate, and directly plating the developed image onto the coated substrate. Coating solutions which work particularly well in this process include a ferric oxalate and palladium emulsion or a silver based emulsion.
Claims21
A direct emulsion process for making a printed circuit comprising the steps of:
- coating a non-metallized substrate with a solution which creates a light sensitive surface on the substrate;
- imaging the coated substrate with a predesigned circuitry by exposing the surface of the coated substrate to a light source;
- developing the imaged substrate with one or more chemistries;
- and
- directly plating the developed image onto the substrate.
A direct emulsion process for making a printed circuit comprising the steps of:
- removing metal from a metal clad substrate;
- coating the non-metallized substrate with a solution which creates a light sensitive surface on the substrate;
- imaging the coated substrate with a predesigned circuitry by exposing the surface of the coated substrate to a light source;
- developing the imaged substrate with one or more chemistries;
- and
- directly plating the developed image onto the substrate.
A direct emulsion system for making a printed circuit comprising:
- a first solution which creates a light sensitive surface when coated on a non-metallized substrate;
- a light source for imaging the coated substrate;
- one or more chemistries for developing the imaged substrate;
- and
- a second solution for plating the developed image onto the substrate.
Dependencies are inferred from the claim text.