Thermal Mass Compensated Dielectric Foam Support Structures for Coaxial Cables and Method of Manufacture
AssigneeAndrew Corporation
InventorsMark Witthoft, Alan Moe
Life of this patent
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Abstract
Thermal mass compensated foam support structures for coaxial cables such as inner conductors and or inner conductor support structures. The foam support structures provided with an adhesive solid or high density foam polymer or blend layer to increase the thermal mass of the support structure enough to allow the foam to surround the adhesive solid or high density foam polymer or blend layer without forming unacceptably large voids in the foam dielectric as the foam dielectric cures.
Claims19
A coaxial cable, comprising:
- an inner conductor;
- an adhesive solid or high density foam polymer or blend surrounding the inner conductor having a thickness at least 30 percent of the inner conductor diameter;
- a foam dielectric surrounding the adhesive solid or high density foam polymer or blend;
- and
- an outer conductor surrounding the foam dielectric.
An inner conductor support structure for a coaxial cable, comprising:
- a plastic rod;
- an adhesive solid or high density foam polymer or blend surrounding the plastic rod having a thickness at least 30 percent of the plastic rod diameter;
- and
- a foam dielectric surrounding the adhesive solid or high density foam polymer or blend.
A method for manufacturing a coaxial cable, comprising the steps of:
- coating an inner conductor with an adhesive solid or high density foam polymer or blend;
- the adhesive solid or high density foam polymer or blend surrounding the inner conductor having a thickness at least 30 percent of the inner conductor diameter;
- surrounding the adhesive solid or high density foam polymer or blend with a foam dielectric;
- and
- surrounding the foam dielectric with an outer conductor.
A coaxial cable, comprising:
- an inner conductor;
- an adhesive solid or high density foam polymer or blend surrounding the inner conductor;
- a foam dielectric surrounding the adhesive solid or high density foam polymer or blend;
- and
- an outer conductor surrounding the foam dielectric;
- the adhesive solid or high density foam polymer or blend having a thickness dimensioned to increase a thermal mass of the adhesive high density polymer coated inner conductor to a level which cures the foam dielectric without forming voids substantially greater than a cell size of the foam dielectric as the foam dielectric cures.
Dependencies are inferred from the claim text.