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US 2009/0020229 A1Published application
Semiconductor chip bonding apparatus
AssigneeSamsung Electronics Co., Ltd.
InventorsCheal-Sang YOON, Yong-Dae Ha, Jae-Ryoung Lee, Jeong-Soon Cho, Bum-Woo Lee, Pil-June Kim
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Abstract
A semiconductor chip bonding apparatus maintains a semiconductor chip a parallel state with a lead frame when applying a bonding load.
Claims19
A semiconductor chip bonding apparatus, comprising:
- a bond head unit to apply a bonding load;
- a chip holding unit to hold a semiconductor chip to be attached to a substrate;
- and
- a balance control unit to transfer the bonding load of the bond head unit to the chip holding unit and to move the chip holding unit so that the chip holding unit is balanced to the substrate.
1 more element
A semiconductor chip bonding apparatus, comprising:
- a bond head unit having a plurality of bond head shafts to apply the bonding load;
- chip holding units to hold semiconductor chips to be attached to a substrate and correspond to the respective bond head shafts;
- and
- balance control units to transfer the bonding load between the corresponding bond head shaft and the chip holding unit, and to move the chip holding unit so that the chip holding unit is balanced to the substrate.
1 more element
Dependencies are inferred from the claim text.