Electronics tester with a signal distribution board and a wafer chuck having different coefficients of thermal expansion

A portable pack, comprising:

• a portable supporting structure including first and second components for holding the substrate therebetween, the substrate carrying a microelectronic circuit and having a plurality of terminals connected to the microelectronic circuit, wherein the second component includes a signal distribution board and a contactor, wherein a CTE ratio of a CTE of the signal distribution board to a CTE of the contactor is not equal to 1;
• a plurality of contacts on the second component, the contacts matching the terminals for making contact to the terminals, and the components are movable relative to one another to ensure proper contact between the contacts and the terminal;
• and
• a first interface, on the portable supporting structure and connected to the contacts, for connection to a second interface on a stationary structure when the portable supporting structure is removable and held by the stationary structure.

A tester apparatus, comprising:

• a portable supporting structure including first and second components for holding the substrate therebetween, the substrate carrying a microelectronic circuit and having a plurality of terminals connected to the microelectronic circuit, wherein the second component includes a signal distribution board and a contactor, wherein a CTE ratio of a CTE of the signal distribution board to a CTE of the contactor is not equal to 1;
• a plurality of contacts on the second component, the contacts matching the terminals for making contact to the terminals, and the components are movable relative to one another to ensure proper contact between the contacts and the terminals;
• a first interface on the portable supporting structure and connected to the contacts;
• a stationary structure, the portable supporting structure being receivable to be held by the stationary structure and being removable from the stationary structure;
• a second interface on the stationary structure, the second interface being connected to the first interface when the portable structure is held by the stationary structure and being disconnected from the first interface when the portable supporting structure is removed from the stationary structure;
• and
• an electrical tester connected through the second interface, the first interface, and the contacts to the terminals so that signals are transmitted between the electrical tester and the microelectronic circuit to test the microelectronic circuit.

A method of testing a microelectronic circuit held by a substrate, comprising:

• holding the substrate between first and second components of a portable supporting structure, the second component having contacts against terminals of the substrate connected to the microelectronic circuit;
• moving the first and second components relatively towards one another to ensure proper contact between the contacts and the terminals, wherein the portable supporting structure together with the substrate include first and second elements, wherein a CTE ratio of a CTE of the first element to a CTE of the second element is not equal to 1;
• receiving the portable supporting structure by a stationary structure with a first interface on the portable supporting structure connected to a second interface on the stationary structure;
• and
• transmitting signals between an electrical tester and the microelectronic circuit through the terminals, contacts, and first and second interfaces to test the microelectronic circuit, wherein the substrate is held between first and second components of the portable supporting structure and the contacts are on the second component, further comprising:
• moving the first and second components relatively towards one another to ensure proper contact between the contacts and the terminals.