Device for testing electronic components, in particular ics, having a sealing board arranged inside a pressure test chamber

A device for testing electronic components, in particular ICs, under particular pressure conditions, having The following features:

• the device comprises a dividable pressure test chamber having two pressure chamber halves which can be separated from one another and brought together, and which can be brought into a contact position in which they tightly enclose a cavity, the pressure test chamber comprises contact elements which extend into the cavity so that the contacts of components to be tested, which are arranged in the cavity, can be brought in contact with assigned contact elements, the contact elements extend through one of the pressure chamber halves and are in electrical contact with an electronic testing device, wherein each contact element is subdivided into a first contact element section passing through the pressure chamber halves and a second contact element section, which is distanced from the first contact element section and is arranged inside the cavity, and in that an air-tight sealing board is arranged inside the cavity and extends transversely over the contact elements and is sealed peripherally from the assigned pressure chamber half, the first contact element sections being arranged on one side of the sealing board and the second contact element sections, lying opposite the first contact element sections, being arranged on the opposite side of the sealing board, and the first contact element sections being electrically connected to the opposite second contact element sections via conductive sections of the sealing board