Method for automated stress testing of flip-chip packages
AssigneeOmniprobe, Inc.
InventorsLyudmila Zaykova-Feldman, Thomas M. Moore
Life of this patent
Estimating the term…
Abstract
Methods for testing flip-chip packages includes aligning a microscope and a test engine. The package under test is placed between the microscope and the test engine, and an acoustic transducer is attached to the package under test. The test engine delivers an impact to the package under test on the side of the package opposite its ball-grid array. Acoustic information and image information from the package under test is recorded. In alternate embodiments, a sequence of packages may be automatically tested.
Claims10
A method for testing flip-chip packages comprising:
- aligning a microscope and a test engine;
- placing a flip-chip package between the microscope and the test engine;
- attaching an acoustic transducer to the flip-chip package;
- delivering an impact from the test engine to the flip-chip package;
- recording in a computer acoustic information from the acoustic transducer attached to the flip-chip package;
- and,
- recording image information from the microscope about the flip-chip package.
A method of testing flip-chip packages comprising:
- loading a JEDEC tray with a pre-determined number of packages;
- choosing a sequence of packages and locations on each package for testing;
- aligning a microscope and a test engine;
- attaching an acoustic transducer to a first flip-chip package;
- delivering an impact from the test engine to the flip-chip package;
- recording in a computer acoustic information from the acoustic transducer attached to the flip-chip package;
- recording image information from the microscope about the flip-chip package;
- continuing testing the flip-chip package at a different location in the sequence until a pre-determined number of locations on the package have been tested;
- and,
- continuing testing on the next package in the sequence.
A method of testing flip-chip packages comprising:
- choosing a holder for a pre-determined set of packages under test;
- choosing a sequence of packages and locations on each package for testing;
- placing the packages under test in the holder;
- aligning a microscope and a test engine;
- attaching an acoustic transducer to a first flip-chip package;
- delivering an impact from the test engine to the flip-chip package;
- recording in a computer acoustic information from the acoustic transducer attached to the flip-chip package;
- recording image information from the microscope about the flip-chip package;
- continuing testing the flip-chip package at a different location in the sequence until all locations on the package have been tested;
- and,
- continuing testing on the next package in the sequence.
Dependencies are inferred from the claim text.