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AssigneeAirDio Wireless Inc.
InventorsWen-Jiunn Tsay, David Yow-Chern Chang, Bao-Tai Hwang, Ling-Haur Huang
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A method for testing a system module assembled by integrated circuits during mass production. The integrated circuits and the assembled system modules are manufactured by the same manufacturer. The method includes the steps of apply a plurality of system level tests to the system module to determine the performance of the system module. Next, verify the performance of the integrated circuits based on the results of the system level tests. Finally, perform integrated circuit level tests, wherein the integrated circuit level tests include test items unverifiable by the system level tests. The present invention also includes a testing apparatus for testing a system module.
A method for testing a system module assembled by a plurality of integrated circuits during mass production, wherein the integrated circuits and the assembled system modules are manufactured by the same manufacturer, comprising:
A testing apparatus for testing a system module assembled by a plurality of integrated circuits in mass production, wherein the integrated circuits and the assembled system module are manufactured by the same manufacturer, comprising:
Dependencies are inferred from the claim text.