Phosphor package of light emitting diodes
OwnerChing-Cherng Sun, Shih-Hsin Ma +1inventors
InventorsChing-Cherng Sun, Shih-Hsin Ma, Tsung-Xian Lee
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Abstract
A phosphor package of light emitting diodes includes a lens made of a transparent optical material, and a side of the lens with at least one phosphor containing groove corresponding to a light emitting diode chip. The concentration of the phosphor is adjusted before a required quantity of phosphor is adhered into the phosphor containing groove. The phosphor is baked and solidified. A gel is filled into the gap between the wire-bonded light emitting chip and the phosphor for binding with each other to complete the manufacturing process of a phosphor package; and such manufacturing process can effectively and accurately control the phosphor to achieve high quality stability and color uniformity.
Claims6
A phosphor package of light emitting diodes (LEDs), comprising the steps of:
- producing a lens made of a transparent optical material, such that a surface of the lens includes at least one phosphor powder containing groove corresponding to a LED chip;
- preparing the concentration of a phosphor powder, and attaching the phosphor powder directly into the phosphor powder containing groove according to a predetermined quantity;
- baking and solidifying the phosphor powder;
- and
- filling up a gel into a gap between a wire-bonded LED chip and the solidified phosphor powder lens to combine the LED chip and the phosphor powder lens, so as to complete the phosphor powder package process.
Dependencies are inferred from the claim text.