Heat dissipation arrangement of a light emitting module
AssigneeKai-Yu Lin
InventorKai-Yu Lin
Life of this patent
Estimating the term…
Abstract
A light emitting module includes a graphite base having a metal bearing surface at one side, a circuit board bonded to the metal bearing surface of the graphite base and having mounting through holes and a circuit layout, and light emitting devices each having a substrate carrying a light emitting chip and mounted in one mounting through hole of the circuit board and kept in contact with the metal bearing surface of the graphite base for transferring heat energy produced during light emitting operation to the graphite base for quick dissipation and two conducting legs electrically connected with the light emitting chip and respectively extended out of the substrate and electrically bonded to the circuit layout of the circuit board.
Claims13
A light emitting module, comprising:
- a graphite base, said graphite base comprising a first metal bearing surface and a second metal bearing surface at two opposite sides thereof and a circuit layout on one said first metal bearing surface;
- and
- at least one light emitting device mounted on said first metal bearing surface and electrically connected with said circuit layout, each said light emitting device comprising a substrate, said substrate having a bottom contact surface disposed in contact with said first metal bearing surface of said graphite base, a light emitting chip mounted in said substrate, and two conducting legs respectively extending from positive and negative poles of said light emitting chip and respectively electrically bonded to said circuit layout.
A light emitting module comprising:
- a graphite base, said graphite base comprising a first metal bearing surface and a second metal bearing surface at two opposite sides thereof;
- a circuit board mounted on said first metal bearing surface of said graphite base, said circuit board comprising at least one mounting through hole cut through top and bottom sides thereof and a circuit layout arranged on the top side of said circuit board opposite to said first metal bearing surface of said graphite base;
- and
- at least one light emitting device respectively mounted in said at least one mounting through hole of said circuit board said and electrically connected with said circuit layout, each said light emitting device comprising a substrate, said substrate having a bottom contact surface disposed in contact with said first metal bearing surface of said graphite base, a light emitting chip mounted in said substrate, and two conducting legs respectively extending from positive and negative poles of said light emitting chip and respectively electrically bonded to said circuit layout.
Dependencies are inferred from the claim text.