Method and arrangement for forming electronic device
AssigneePerlos Oyj
InventorsEsa Muukkonen, Tero Peltola
Life of this patent
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Abstract
An insert (2) is arranged in an injection mould (1) and plastic is cast onto the insert (2). The insert (2) includes at least one electronic component and connector (4) for testing the component. The injection mould (1) is provided with a counter connector (5) which is arranged to connect to the connector (4). The condition of the insert (2) is tested by a testing device connected to the counter connector (5) during the injection moulding process.
Claims14
1-13. (canceled)
A method of forming an electronic device, the method comprising, providing an injection mould with a counter connector, arranging an insert that includes at least one electronic component and a connector in the injection mould so that the connector of the insert connects to the counter connector in the injection mould, casting plastic onto the insert and testing the condition of the insert during the injection moulding process.
An arrangement for forming an electronic device, the arrangement comprising an injection mould, an insert that includes at least one electronic component and a connector arranged inside the injection mould, a counter connector in connection with the injection mould to which the connector of the insert is connectable, and a testing device connected to the counter connector for testing the condition of the insert.
Dependencies are inferred from the claim text.