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US 2009/0014899 A1Published application
Integrated circuit package system including stacked die
AssigneeSTATS ChipPAC, Ltd.
InventorsSoo-San Park, Hyeog Chan Kwon, Sang-Ho Lee, Jong-Woo Ha
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Abstract
An integrated circuit package system is provided including providing a wafer with bond pads formed on the wafer. A solder bump is deposited on one or more bond pads. The bond pads and the solder bump are embedded within a mold compound formed on the wafer. A groove is formed in the mold compound to expose a portion of the solder bump. The wafer is singulated into individual die structures at the groove.
Claims10
An integrated circuit package system comprising:
- a die with bond pads formed on the die;
- a solder bump deposited on one or more bond pads;
- a mold compound formed on the die, the mold compound embedding the bond pads and the solder bump;
- and
- a recess formed into the edges of the mold compound to expose a portion of the solder bump.
2 more elements
Dependencies are inferred from the claim text.