Solder cap application process on copper bump using solder powder film
AssigneeTexas Instruments Incorporated
InventorsSatyendra S. Chauhan, Rajiv C. Dunne, Gary P. Morrison, Masood Murtuza
Life of this patent
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Abstract
A method used during the formation of a semiconductor device assembly can include contacting an end of a conductive bump (which can be a pillar, ball, pad, post, stud, or lead as well as other types of bumps) with a conductive powder such as a solder powder to adhere the conductive powder to the end of the bump. The powder can be flowed, for example by heating, to distribute it across the end of the bump. The flowed powder can be placed in contact with a conductive pad of a receiving substrate and can then be reflowed to facilitate electrical connection between the bump and the conductive pad.
Claims21
A method used to form a semiconductor device, comprising:
- providing a film comprising an adhesive and a conductive powder which is adhered to the adhesive of the film;
- applying an adhesive to an end of a conductive bump;
- contacting the adhesive on the end of the conductive bump with the conductive powder adhered to the adhesive to transfer the conductive powder from the film to the end of the conductive bump;
- flowing the conductive powder on the end of the conductive bump to distribute the conductive powder across the end of the conductive bump;
- subsequent to flowing the conductive powder, placing the flowed conductive powder on the end of the conductive bump in physical contact with a conductive pad;
- and
- reflowing the flowed conductive powder to facilitate electrical connection between the conductive bump and the conductive pad.
A method used to form a semiconductor device assembly, comprising:
- providing a semiconductor device having a plurality of conductive bumps formed thereon;
- providing a receiving substrate having a plurality of conductive landing pads formed thereon;
- providing a film comprising an adhesive and a dry solder powder which is adhered to the adhesive of the film;
- applying an adhesive to ends of the plurality of conductive bumps;
- contacting the adhesive on the ends of the plurality of conductive bumps with the dry solder powder adhered to the adhesive to transfer the solder powder to an end of each conductive bump;
- heating the solder powder to flow the solder powder and to distribute the solder powder across the end of each conductive bump;
- cleaning the flowed solder powder;
- contacting the flowed solder powder on the end of each conductive bump with one of the plurality of conductive landing pads of the receiving substrate;
- and
- with the flowed solder powder on the end of each conductive bump contacting one of the plurality of conductive landing pads of the receiving substrate, reflowing the flowed solder powder to facilitate electrical connection between the plurality of conductive bumps and the plurality of conductive landing pads.
A method used to form a semiconductor device, comprising:
- providing a carrier material having first and second sides and a solder powder coated on both the first and second sides of the carrier material;
- providing a first semiconductor die and a second semiconductor die each having conductive bumps thereon;
- simultaneously contacting the conductive bumps on the first semiconductor die with the solder powder on the first side of the carrier material and the conductive bumps on the second semiconductor die with the solder powder on the second side of the carrier material to simultaneously adhere the solder powder to the bumps on the first semiconductor die and on the second semiconductor die;
- and
- flowing the solder powder to distribute the solder powder across an end of the conductive bumps of the first semiconductor die and the second semiconductor die.
An in-process semiconductor device assembly, comprising:
- at least one conductive bump having an end;
- an adhesive material on the end of the at least one bump;
- a conductive powder adhered to the end of the at least one conductive bump by the adhesive material;
- and
- a receiving substrate comprising at least one conductive landing pad, wherein the at least one conductive landing pad is adapted for electrical connection with the at least one conductive bump using the conductive powder.
Dependencies are inferred from the claim text.