Flip-chip package structure, and the substrate and the chip thereof
AssigneePhoenix Precision Technology Corporation
InventorShih-Ping Hsu
Life of this patent
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Abstract
A flip-chip package structure is disclosed, which comprises: a packaging substrate having an upper surface and a plurality of conductive pads formed on the upper surface; a semiconductor chip having an active surface and a plurality of electrode pads formed on the active surface; and a plurality of first solder bumps; wherein each first solder bump connects to an electrode pad and a conductive pad, and each first solder bump contains a solid grain.
Claims25
A flip-chip package structure, which comprises:
- a packaging substrate having an upper surface and a plurality of conductive pads formed on the upper surface of the substrate;
- a semiconductor chip having an active surface and a plurality of electrode pads formed on the active surface;
- and
- a plurality of first solder bumps, wherein each first solder bump connects to an electrode pad and a conductive pad, and each first solder bump comprises a solid grain.
A flip-chip package structure, which comprises:
- a packaging substrate having an upper surface and a plurality of conductive pads locating on the upper surface of the substrate;
- a plurality of third solder bumps connecting to the conductive pads;
- a semiconductor chip having an active surface and a plurality of electrode pads formed on the active surface;
- a plurality of second solder bumps connecting to the electrode pads;
- and
- a plurality of solid grains, wherein the solid grains are correspondingly connected to the second solder bumps and the third solder bumps.
A flip-chip packaging substrate, which comprises:
- a packaging substrate having an upper surface and a plurality of conductive pads formed on the upper surface of the substrate;
- a solder mask forming on the surface of the substrate, and the solder mask has a plurality of openings to expose the conductive pads;
- a plurality of third solder bumps connecting to the conductive pads;
- and
- a plurality of solid grains, wherein the solid grains are located on the third solder bumps.
A package chip for flip-chip, comprising:
- a semiconductor chip having an active surface and a plurality of electrode pads locating on the active surface;
- a passivation layer covering on the active surface, and the passivation layer has a plurality of openings to expose the electrode pads;
- a plurality of second solder bumps connecting to the electrode pads;
- and
- a plurality of solid grains, wherein the solid grains are located on the second solder bumps.
Dependencies are inferred from the claim text.