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US 2009/0014893 A1Published application
Integrated circuit package system with wire-in-film isolation barrier
AssigneeSTATS ChipPAC, Ltd.
InventorJonathan Abela
Life of this patent
Estimating the term…
Abstract
An integrated circuit package in package system includes: providing a substrate having a first wire-bonded die with an active side mounted above; connecting the active side of the first wire-bonded die to the substrate with a bond-wire; mounting a wire-in-film adhesive having an isolation barrier over the first wire-bonded die; and encapsulating the first wire-bonded die, the bond-wires, and the wire-in-film adhesive with an encapsulation.
Claims20
An integrated circuit package in package system comprising:
- providing a substrate having a first wire-bonded die with an active side mounted above;
- connecting the active side of the first wire-bonded die to the substrate with a bond-wire;
- mounting a wire-in-film adhesive having an isolation barrier over the first wire-bonded die;
- and
- encapsulating the first wire-bonded die, the bond-wires, and the wire-in-film adhesive with an encapsulation.
2 more elements
An integrated circuit package in package system comprising:
- providing a substrate having a first wire-bonded die with an active side mounted above;
- connecting the active side of the first wire-bonded die to the substrate with a bond-wire;
- mounting a wire-in-film adhesive having a compound density isolation barrier over the first wire-bonded die;
- mounting a structure over the first wire-bonded die and the isolation barrier;
- connecting the structure with the bond-wires to the substrate;
- and
- encapsulating the first wire-bonded die, the bond-wires, and the wire-in-film adhesive with an encapsulation.
4 more elements
An integrated circuit package in package system comprising:
- a substrate having a first wire-bonded die with an active side mounted above;
- a bond-wire connecting the active side of the first wire-bonded die to the substrate;
- a wire-in-film adhesive having an isolation barrier mounted over the first wire-bonded die;
- and
- an encapsulation encapsulating the first wire-bonded die, the bond-wires, and the wire-in-film adhesive.
2 more elements
Dependencies are inferred from the claim text.