Semiconductor device

Abstract

A semiconductor device includes an effective wire formed above a substrate in a multilayer interconnection structure and having a first electrode pad in a top layer; a first reinforcing material formed in the multilayer interconnection structure like surrounding the effective wire; a protective film configured to protect a final surface of the multilayer interconnection structure; and a second reinforcing material formed at a position in contact with the protective film and also between an area in which the effective wire is formed and a chip area end, the second reinforcing material being constituted by a film pattern whose Young's modulus is larger than that of a conductor constituting the first electrode pad and that of a conductor constituting the first reinforcing material.

Dependencies are inferred from the claim text.