Bonding pad for preventing pad peeling and method for fabricating the same
AssigneeHynix Semiconductor Inc.
InventorJeong-Soo KIM
Life of this patent
Estimating the term…
Abstract
A bonding pad includes multiple metal layers, insulation layers filled between the multiple metal layers, and a fixing pin coupled between the uppermost metal layer, where a bonding is performed, and the underlying metal layers. Peeling of the bonding pad can be prevented during the ball bonding by forming the fixing pin coupled to the edges of the bonding pad. The upper portion of the fixing pin is formed in a disk shape and a ball portion of the fixing pin is fixed by slits such that the peeling of the bonding pad can be further prevented.
Claims18
A bonding pad, comprising:
- multiple metal layers;
- insulation layers disposed between the multiple metal layers;
- and
- a fixing pin coupled between an uppermost metal layer and an underlying metal layer of the multiple metal layers, wherein a bonding is performed on the uppermost metal layer.
A method for fabricating a bonding pad, the method comprising:
- forming a first insulation layer;
- forming a plurality of slits over the first insulation layer;
- forming a second insulation layer over the slits;
- partially etching the second insulation layer and the first insulation layer to form a contact hole defined in an interval between the slits;
- forming a fixing pin filling the contact hole;
- and
- forming a metal layer coupled to the fixing pin, wherein a bonding is to be performed on the metal layer.
Dependencies are inferred from the claim text.