Semiconductor apparatus and manufacturing method of semiconductor apparatus

A semiconductor apparatus, comprising:

• a semiconductor chip including a plurality of electrode pads arranged in a central area of one surface;
• a wired board which is arranged as facing one surface of the semiconductor chip, and which includes a wiring and a plurality of land parts;
• a plurality of bump electrodes which are provided between surfaces of the semiconductor chip and the wired board facing each other, and which electrically connect the electrode pads and the wiring;
• a plurality of external terminals which correspond to a plurality of the bump electrodes, and which are mounted on the land parts of the wired board;
• and
• insulating material which is provided between the semiconductor chip and the wired board, and which covers at least a connection part between the bump electrodes and the wiring,
• wherein the wiring of the wired board is configured to run in a straight line from a position at which the bump electrode is mounted in a semiconductor chip-mounted surface of the wired board to an external terminal-mounted surface of the wired board, and also, to electrically connect the bump electrode and the corresponding external terminal, and
• a distance in a horizontal direction is set to 0.75 mm or less from a position at which the bump electrode is mounted on the wired board to a central position of the land part of a plurality of the land parts which is the closest to the position at which the bump electrode is mounted.

A semiconductor producing method, comprising:

• providing a semiconductor chip which includes a plurality of electrode pads, and in which a plurality of bump electrodes are formed on the electrode pads;
• providing a wired board, which includes base material, a land part which is a land part corresponding to a plurality of the bump electrodes, is provided on the base material, and mounts a plurality of external terminals, and a wiring which is configured to straightly connect from a position at which the bump electrode is mounted in a semiconductor chip-mounted surface of the base material, to an external terminal-mounted surface of the base material, and said wiring electrically connects the bump electrode and the corresponding land part;
• mounting the semiconductor chip on the wired board by flip chip bonding that the wiring runs in a straight line from the position at which the bump electrode is mounted to the external terminal-mounted surface of the wired board;
• and
• forming the external terminal on the land part of the wired board.