Electronic device and manufacturing method
AssigneePanasonic Corporation
InventorsYasuo Yokota, Hisahiko Yoshida
Life of this patent
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Abstract
An electronic device including a semiconductor device with a plurality of bump electrodes, a mounting board connected to the semiconductor device, thermally expandable particles, and adhesive. The thermally expandable particles are provided on the sides of the semiconductor device and the surface of the mounting board around a projected area of the semiconductor device. The adhesive is provided on the sides of the semiconductor device and the surface of the mounting board such that it covers the area of thermally expandable particles. This improves the impact resistance of the semiconductor device soldered onto the mounting board, and also facilitates removal of the semiconductor device from the mounting board when the semiconductor device needs repair.
Claims20
An electronic device comprising:
- a semiconductor device having a plurality of connecting terminals;
- and
- a mounting board facing the semiconductor device, and being connected to the connecting terminals;
- wherein thermally expandable particles are provided on at least one of a side of the semiconductor device and a surface of the mounting board around a projected area of the semiconductor device, the thermally expandable particles being covered with adhesive.
A method of manufacturing an electronic device, comprising:
- electrically connecting a semiconductor device and a mounting board, the semiconductor device having a plurality of connecting terminals;
- and
- applying thermally expandable particles to at least one of a side of the semiconductor device and a surface of the mounting board around a projected area of the semiconductor device, and covering the thermally expandable particles with adhesive.
A method of removing a semiconductor device in an electronic device, the electronic device including:
- the semiconductor device having an electrode aligned on its one main face;
- and
- a mounting board having a board electrode, the board electrode being electrically connected to the electrode of the semiconductor device by a solder bump;
- wherein curable resin bonds and fixes at least one of a part of a side of the semiconductor device and the mounting board, and thermally expandable particles are mixed in at least a part of a boundary area between the curable resin and the mounting board;
- and
- the removal method comprising:
- heating the curable resin at a temperature higher than its curing temperature but not higher than a melting point of the solder bump so as to thermally expand the thermally expandable particles;
- and
- removing the semiconductor device bonded and fixed by the curable resin from the mounting board.
Dependencies are inferred from the claim text.