Method for manufacturing a circuit board structure, and a circuit board structure
AssigneeImbera Electronics Oy
InventorsRisto Tuominen, Antti Iihola, Petteri Palm
Life of this patent
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Abstract
This publication discloses a method for manufacturing a circuit-board structure.1. The structure comprises a conductor pattern (3) and at least one component (6), which is surrounded by an insulating-material layer (10), attached to it by means of a contact bump (5). According to the invention, the contact bumps (5) are made on the surface of the conductor pattern (3), before the component (6) is attached to the conductor pattern (3) by means of the contact bump (5). After attaching, the component (6) is surrounded with an insulating-material layer (10).
Claims30
Method for manufacturing a circuit-board structure, which structure comprises a conductor pattern (3) and a component (6), which is surrounded by an insulating-material layer (10) and is attached to the conductor pattern by means of at least one contact bump (5), characterized in that in the method at least one contact bump (5) is made on the surface of the conductor pattern (3), before the component (6) is attached to the conductor pattern (3) by means of the contact bump (5).
Circuit-board structure, which comprises a conductor pattern (3) and at least one component (6), which is connected to the conductor pattern through a contact bump (5), and which is surrounded by an insulating-material layer (10), characterized in that at least one contact bump (5) has been manufactured on the surface of the conductor pattern (3) before connecting the component (6) to the conductor pattern (3) through the contact bump (5).
Dependencies are inferred from the claim text.