Semiconductor chip and package process for the same

A package process comprising:

• providing a flip chip package that comprises a chip and a plurality of bumps, wherein the chip comprises a plurality of chip bump pads thereon, and the chip bump pads comprises at least two physically connected chip bump pads, and the bumps are disposed on the chip bump pads;
• providing a substrate that comprises a plurality of bump pads on a first surface of the substrate and a plurality of ball pads on a second surface of the substrate;
• and
• physically connected the bumps of the flip chip package with portions of the bump pads of the substrate, wherein the two bump pads, which correspond to the two physically connected chip bump pads, on the substrate are physically connected to one of the ball pads.