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US 2009/0014867 A1Published application
Seal ring for glass wall microelectronics package
OwnerCasey Krawiecinventor
Life of this patent
Estimating the term…
Abstract
A seal ring formed from a conductive material has at least one recessed area formed on an internal or external surface which is dimensioned to permit attachment of a wire bond so that the wire and any attachment material remain recessed from the upper and lower contact surfaces of the seal ring, allowing the seal ring to make flat and even contact with the adjacent package layer so that a hermetic seal is formed.
Claims15
A seal ring for a hermetically sealed microelectronic package, comprising:
- a conductive planar ring having a ring thickness, an inner surface, an outer surface and a ring width between the inner surface and the outer surface, wherein at least one recess is formed in one of the inner surface and the outer surface, the recess having dimensions of less than the ring thickness and less than the ring width to define a step adapted for attachment of a wirebond;
- and
- a finish plating disposed on the step, the finish plating comprising a conductive metal.
A seal ring for a hermetically sealed microelectronic package having a grounded base, the seal ring comprising:
- a conductive planar ring having a uniform ring thickness and four sides, each having an inner side, an outer side, with a ring width between the inner side and the outer side wherein at least one recess is formed in the inner side, the recess having dimensions of less than the ring thickness and less than the ring width to define a step adapted for attachment of a wirebond for connecting the seal ring to the grounded base.
Dependencies are inferred from the claim text.