Multichip module package and fabrication method
AssigneeSTATS ChipPAC, Ltd.
InventorsIl Kwon Shim, Dario S. Filoteo, JR., Tsz Yin Ho, Sebastian T. M. Soon
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Abstract
A method for fabricating a multichip module package includes providing a first heat sink positioned for releasing heat from the package and providing a second heat sink positioned proximate the first heat sink. The heat sinks are thermally coupled and electrically isolated to and from one another. A first semiconductor device is attached to the first heat sink in thermal and electrical communication therewith and electrically insulated from the second heat sink. A second semiconductor device is attached to the second heat sink in thermal and electrical communication therewith and electrically insulated from the first heat sink.
Claims10
A multichip module package, comprising:
- a first heat sink positioned for releasing heat from the package;
- a second heat sink positioned proximate the first heat sink;
- means thermally coupling and electrically isolating the heat sinks to and from one another;
- a first semiconductor device attached to the first heat sink in thermal and electrical communication therewith and electrically insulated from the second heat sink;
- and
- a second semiconductor device attached to the second heat sink in thermal and electrical communication therewith and electrically insulated from the first heat sink.
A multichip module package, comprising:
- a first heat sink positioned for releasing heat from the package;
- a second heat sink positioned beneath the first heat sink;
- means thermally coupling and electrically isolating the heat sinks to and from one another;
- a substrate attached to the second heat sink on the side thereof opposite the first heat sink;
- a first semiconductor device attached to the first heat sink through and in thermal and electrical communication therewith and electrically insulated from the second heat sink;
- a second semiconductor device attached to the second heat sink in thermal and electrical communication therewith and electrically insulated from the first heat sink;
- and
- an encapsulant environmentally encapsulating the first and second semiconductor devices.
Dependencies are inferred from the claim text.