Microbump seal
AssigneeInternational Business Machine Corporation
InventorJohn U. Knickerbocker
Life of this patent
Estimating the term…
Abstract
A sealable microelectronic device providing mechanical stress endurance which includes a semiconductor substrate. A substantially continuous sealing element is positioned adjacent an outer periphery and between a microelectronic component and the semiconductor substrate, or another microelectronic component. The sealing element seals the microelectronic component to the substrate or another microelectronic component, and provides structural support to the microelectronic device.
Claims20
A microelectronic device, comprising:
- a plurality of microelectronic components each having an outer periphery;
- and
- at least one substantially continuous sealing element positioned between a pair of microelectronic components, the at least one substantially continuous sealing element being positioned substantially adjacent the outer periphery of the microelectronic components for sealing the microelectronic components together, and for providing structural support to the microelectronic device.
A sealable microelectronic package providing mechanical stress endurance, comprising:
- a plurality of microelectronic components each having an outer periphery and mounted on one another;
- and
- a plurality of substantially continuous sealing elements between the microelectronic components, the plurality of substantially continuous sealing elements positioned substantially adjacent the outer periphery of the microelectronic components for sealing the microelectronic components to each other for providing structural support to the microelectronic device.
A method for manufacturing a microelectronic device, comprising:
- providing a plurality of microelectronic components;
- mounting at least one microelectronic component having an outer periphery on another microelectronic component or a substrate;
- and
- positioning at least one substantially continuous sealing element substantially adjacent the outer periphery of the at least one microelectronic component and between the microelectronic component and another microelectronic component for sealing the microelectronic components together, and for providing structural support to the microelectronic device.
Dependencies are inferred from the claim text.