Semiconductor integrated circuit device and method of manufacturing the same

A semiconductor integrated circuit device comprising:

• a die pad;
• a semiconductor chip mounted over said die pad, said semiconductor chip having a main surface, a back surface opposing to said main surface, and a plurality of surface electrodes formed over the main surface;
• a plurality of suspension leads supporting said die pad;
• a plurality of leads arranged around said semiconductor chip, each of said plurality of leads having an inner lead portion and an outer lead portion;
• a first plating layer formed at a part of said inner lead portions;
• a plurality of wires electrically connecting said plurality of surface electrodes of said semiconductor chip with said plurality of inner lead portion of each of said plurality of leads through said first plating layer;
• a resin body sealing said die pad, said semiconductor chip, said plurality of wires and said inner lead portion of each of said plurality of leads;
• and
• a second plating layer formed over said outer lead portions;
• wherein said second plating layer is comprised of different materials than said first plating layer;
• and
• wherein said second plating layer is a Pb-free metal layer.