Flip-Chip Packaging with Stud Bumps

A method for forming a package structure, the method comprising:

• providing a semiconductor die;
• providing a package substrate;
• forming stud bumps on the package substrate;
• and
• bonding the semiconductor die to the package substrate, wherein the stud bumps electrically connect the semiconductor die and the package substrate.

An integrated circuit package structure comprising:

• a semiconductor die;
• a package substrate;
• and
• stud bumps between, and electrically connecting, the semiconductor die and the package substrate, wherein the stud bumps each has a first portion closer to the semiconductor die, and a second portion closer to the package substrate, and wherein the first portion has a smaller width than the second portion.

An integrated circuit package structure comprising:

• a semiconductor die comprising a top surface, and bond pads on the top surface;
• a package substrate;
• and
• stud bumps between, and electrically connecting, each of the bond pads on the semiconductor die to the package substrate, wherein the stud bumps are physically connected to the package substrate, and wherein at least one of the stud bumps is physically spaced apart from respective ones of the bond pads.