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US 2009/0014849 A1Published application
Integrated circuit package system with multiple molding
AssigneeSTATS ChipPAC, Ltd.
InventorsZigmund Ramirez Camacho, Jose Alvin Caparas, Arnel Trasporto, Jeffrey D. Punzalan
Life of this patent
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Abstract
An integrated circuit package system is provided forming a lead from a padless lead frame, and encapsulating the lead for supporting an integrated circuit die with a first molding compound for encapsulation with a second molding compound.
Claims19
A method for manufacturing an integrated circuit package system comprising:
- forming a lead from a padless lead frame;
- and
- encapsulating the lead for supporting an integrated circuit die with a first molding compound for encapsulation with a second molding compound.
An integrated circuit package system comprising:
- a lead from a padless lead frame;
- and
- the lead for supporting an integrated circuit die with a first molding compound for encapsulation with a second molding compound.
A method for manufacturing an integrated circuit package system comprising:
- forming a lead from a padless lead frame;
- placing a single integrated circuit die on a plane substantially same as the lead;
- attaching an electrical interconnect between the integrated circuit die and the lead;
- encapsulating the single integrated circuit die, the electrical interconnect, and the lead with a first molding compound bounded to the plane;
- and
- encapulating the single integrated circuit die and the lead with a second molding compound to the plane.
3 more elements
An integrated circuit package system comprising:
- a lead from a padless lead frame;
- a single integrated circuit die on a plane substantially same as the lead;
- an electrical interconnect between the single integrated circuit die and the lead;
- the single integrated circuit die, the electrical interconnect, and the lead molded with a first molding compound bounded to the plane;
- and
- the single integrated circuit die and the lead molded with a second molding compound to the plane.
3 more elements
Dependencies are inferred from the claim text.