Integrated circuit package structure with electromagnetic interference shielding structure

Abstract

An integrated circuit (IC) package structure with an electromagnetic interference (EMI) shielding structure utilizes double-layer successive cladding process. A dielectric coating layer and an EMI shielding layer material are sequentially coated on surface of a carrying substrate, an IC on the carrying substrate, and all the other devices. The EMI shielding layer is closely adhered to and bonded on a ground metal area exposed on an upper surface of the carrying substrate, the EMI shielding layer on the package is connected to a ground plane under the carrying substrate in series, so as to form a protection cover having a closed EMI shielding space to isolate the interference of electromagnetic waves from outside.

Dependencies are inferred from the claim text.