Semiconductor device and method of manufacturing the same

Abstract

A semiconductor device includes a first substrate, a plurality of cell transistors and a second substrate. The first substrate has a first surface and a second surface opposite to the first surface. The plurality of cell transistors is formed extending on the first surface of the first substrate in a direction. The second substrate has an upper surface making contact with the second surface of the first substrate. Further, the upper surface of the second substrate has a bent structure to apply tensile stresses to the first substrate in the extending direction of the plurality of cell transistors. Thus, tensile stresses may be applied to the first substrate to improve the mobility of carriers in a channel region of the cell transistors.

Dependencies are inferred from the claim text.