Image sensor module at wafer level, method of manufacturing the same, and camera module
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsChang Hyun Lim, Seog Moon Choi, Dae Jun Kim, Won Kyu Jeung, Jingli Yuan
Life of this patent
Estimating the term…
Abstract
Provided is an image sensor module at the wafer level including a wafer; an image sensor mounted on one surface of the wafer; a wireless communication chip formed outside the image sensor on the one surface of the wafer; and a protective cover installed on the one surface of the wafer.
Claims39
An image sensor module at the wafer level comprising:
- a wafer;
- an image sensor mounted on one surface of the wafer;
- a wireless communication chip formed outside the image sensor on the one surface of the wafer;
- and
- a protective cover installed on the one surface of the wafer.
A method of manufacturing an image sensor module at the wafer level, comprising:
- mounting a plurality of image sensors on one surface of a wafer;
- forming metal wiring lines to be electrically connected to the image sensors, respectively;
- forming a plurality of wireless-communication chips on the one surface of the wafer such that the wireless-communication chips are electrically connected to the metal wiring lines, respectively;
- installing a protective cover on the one surface of the wafer;
- and
- dicing the wafer into a plurality of image sensor modules along a scribe line of the wafer.
An image sensor module at the wafer level comprising:
- a wafer;
- an image sensor mounted on one surface of the wafer;
- a wireless communication chip formed outside the image sensor on the one surface of the wafer;
- a protective cover installed above the one surface of the wafer;
- and
- a spacer interposed between the wafer and the protective cover such that the protective cover is spaced at a predetermined distance from the one surface of the wafer.
A method of manufacturing an image sensor module at the wafer level, comprising:
- mounting a plurality of image sensors on one surface of a wafer;
- forming metal wiring lines to be electrically connected to the image sensors, respectively;
- forming a plurality of wireless-communication chips on the one surface of the wafer such that the wireless-communication chips are electrically connected to the metal wiring lines, respectively;
- forming a spacer on the one surface of the wafer;
- installing a protective cover on the one surface of the wafer through the spacer;
- and
- dicing the wafer into a plurality of image sensor modules along a scribe line of the wafer.
An image sensor module at the wafer level comprising:
- a wafer;
- an image sensor mounted on one surface of the wafer;
- a wireless-communication chip formed outside the image sensors on the one surface of the wafer;
- a bonding spacer formed on the one surface of the wafer so as to seal the image sensor and the wireless-communication chip;
- and
- a protective cover installed on the bonding spacer so as to protect the image sensors and the wireless-communication chip from outside.
An image sensor module at the wafer level comprising:
- a wafer;
- an image sensor mounted on one surface of the wafer;
- a wireless-communication chip formed outside the image sensor on the one surface of the wafer;
- a bonding spacer formed on the one surface of the wafer so as to seal only the image sensor;
- and
- a protective cover installed on the bonding spacer so as to protect the image sensors from outside.
A method of manufacturing an image sensor module at the wafer level, comprising:
- mounting a plurality of image sensors on one surface of a wafer;
- forming metal wiring lines to be electrically connected to the image sensors, respectively;
- forming a plurality of wireless-communication chips on the one surface of the wafer such that the wireless-communication chips are electrically connected to the metal wiring lines, respectively;
- applying a bonding spacer on the one surface of the wafer;
- installing a protective cover on the one surface of the wafer through the bonding spacer;
- and
- dicing the wafer into a plurality of image sensor modules along a scribe line of the wafer.
An image sensor module comprising:
- a semiconductor element having an image sensor formed on the central region thereof and a wireless-communication chip formed on the edge thereof through a semiconductor process.
A camera module comprising:
- an image sensor module at the wafer level including:
- a wafer;
- an image sensor mounted on one surface of the wafer;
- a wireless communication chip formed outside the image sensor on the one surface of the wafer;
- and
- a protective cover installed on the one surface of the wafer.
Dependencies are inferred from the claim text.