Solid state imaging device in which a plurality of imaging pixels are arranged two-dimensionally, and a manufacturing method for the solid state imaging device

A solid state imaging device in which a plurality of imaging pixels are arranged two-dimensionally along a main face of a semiconductor substrate with gaps between adjacent imaging pixels, the solid state imaging device comprising:

• a plurality of light receiving portions that are operable to perform photoelectric conversion and have been formed in one-to-one correspondence with the plurality of imaging pixels;
• a plurality of optical filters that have been formed in one-to-one correspondence with the plurality of imaging pixels and are disposed above the plurality of light receiving portions;
• and
• a plurality of light blocking portions that are operable to block light, each being provided between a different pair of adjacent imaging pixels and having been formed on the main face of the semiconductor substrate to a height in a thickness direction of the semiconductor substrate that is greater than or substantially equal to top edges of the plurality of optical filters.