Microelectronic imagers and methods for manufacturing such microelectronic imagers

A method of fabricating a microelectronic imager, the method comprising:

• juxtaposing conductive bumps at a front side of a microelectronic die with one or more conductive traces in a cavity of a pre-molded imager housing, the housing being composed, at least in part, of a photo-reactive thermoplastic material, and wherein the microelectronic die includes an image sensor at the front side of the microelectronic die and at least partially aligned with one or more optical elements carried by the housing and aligned with the cavity;
• physically and electrically attaching the conductive bumps to the corresponding conductive traces;
• and
• depositing an encapsulant into the cavity to at least partially encapsulate the microelectronic die.

A method of constructing a microelectronic imager, the method comprising:

• locating a microelectronic die including an image sensor within a cavity in a Molded Interconnect Device (MID), wherein the image sensor is facing and spaced apart from an optical element carried by the MID;
• attaching a plurality of terminals at a front side of the microelectronic die to corresponding conductive trace portions of the MID within the cavity;
• applying a volume of adhesive material between the front side of the microelectronic die and the MID and out of contact with the image sensor and at least a portion of the optics unit;
• and
• encapsulating the microelectronic die.

A microelectronic imager, comprising:

• an imager housing unit including (a) a body having a recess with lead-in surfaces and a support surface, and (b) a plurality of electrically conductive traces on and/or in the body;
• an optics unit attached to the housing unit and including one or more optical elements at least partially aligned with the recess;
• a microelectronic die including a front side, a back side opposite the front side, and an image sensor and a plurality of terminals at the front side, wherein the microelectronic die is attached in a flip-chip configuration to corresponding conductive traces in the recess;
• and
• an encapsulant in the recess and encapsulating at least a portion of the microelectronic die.

A microelectronic imager, comprising:

• a MID having (a) a cavity with lead-in surfaces and a support surface, and (b) a plurality of conductive traces arranged in a desired trace pattern on the surface of the MID;
• an optical element attached to the MID and aligned with the cavity;
• a microelectronic die in the cavity and electrically coupled to corresponding conductive trace portions at the support surface in a flip-chip arrangement, the microelectronic die including an image sensor at least partially aligned with and spaced apart from the optical element;
• and
• an encapsulate in the cavity and at least partially encapsulating the microelectronic die and at least a portion of the conductive traces in the recess.

A system, comprising:

• at least one of a processor, a memory device, and a microelectronic imager, the imager
• comprising—
• an imager housing unit including (a) a body having a recess with lead-in surfaces and a support surface, and (b) a plurality of electrically conductive traces on and/or in the body;
• an optics unit attached to the housing unit and including one or more optical elements at least partially aligned with the recess;
• a microelectronic die including a front side, a back side opposite the front side, and an image sensor and a plurality of terminals at the front side, wherein the microelectronic die is attached in a flip-chip configuration to corresponding conductive traces in the recess;
• and
• an encapsulant in the recess and encapsulating at least a portion of the microelectronic die.