Micromechanical Component, Method for Fabrication and Use

The component according to claim 26,

• in which the interlayers comprise a dielectric into which electrically conductive connecting structures are embedded in such a way that there is an electrically conductive connection between the circuit arrangement, the metal layers and the membrane.

The component according to claim 26, in which the circuit arrangement in the substrate comprises an integrated circuit arrangement.

The component according to claim 26, in which the substrate is an IC component comprising an integrated circuit for operating a sensor.

The component according to claim 26, in which at least two further metal layers and at least three interlayers arranged alternately with respect thereto are arranged in the stack below the metal layer lengthened to form the membrane.

The component according to claim 26, in which at least the metal layer lengthened to form the membrane is embedded between an upper and a lower passivation layer.

The component according to claim 26, in which the membrane has a pattern of perforations.

The component according to claim 26,

• in which a first and a second stack with identical multilayer construction are provided, and
• in which the membrane is formed in reed-type fashion and comprises a metal layer which is associated with both stacks and which can vibrate freely between the stacks.

The component according to claim 26,

• in which the membrane is formed in reed-type fashion and has a mass loading at the free end opposite to the stack.

The component according to claim 26,

• in which spacer structures are adjacent to the lateral edges of the multilayer construction.

Component according to claim 26,

• in which at least one layer selected from dielectric and passivation layer comprises titanium nitride.

Component according to claim 26,

• in which the metal layers comprise aluminium or copper.

The component according claim 26,

• in which the dielectric is selected from an oxide, a nitride or an oxynitride.

The component according to claim 26,

• in which a covering is provided above the membrane at a distance from the latter.

The component according to claim 26, in which an electrode is arranged below the freely vibrating membrane in or on the substrate, said electrode forming a capacitance with respect to the membrane, and

• in which the circuit arrangement is designed to generate a measurement signal proportional to said capacitance.

The component according to claim 26, in which the upper passivation layer has a different layer thickness from the lower passivation layer at least at the freely vibrating membrane for the purpose of stress compensation.

The component according to claim 26, in which a stress compensation layer is provided on or above the membrane.

A method for measuring an acceleration or a pressure, or for producing a microphone, wherein the method is comprised of providing the component according to claim 26 as a microsensor.

A method for fabricating an electrostatic switch comprised of providing the component according to claim 26.