Back-illuminated type solid-state image pickup device and camera module using the same

A solid-state image pickup device comprising:

• an image pickup pixel section which is provided on a semiconductor substrate and in which a plurality of pixels each having a photoelectric conversion element and a field-effect transistor are arranged, and a peripheral circuit section for the image pickup pixel section, an interconnect layer driving the field-effect transistor in the image pickup pixel section being formed on a first surface side of the semiconductor substrate, a light receiving surface of the photoelectric conversion element being located on a second surface side of the semiconductor substrate;
• and
• a pad electrode located on the first surface side of the semiconductor substrate and exposed from the second surface side of the semiconductor substrate,
• wherein a pad opening is formed on the pad electrode on the first surface side of the semiconductor substrate.

A camera module comprising:

• a solid-state image pickup device comprising an image pickup pixel section in which a plurality of pixels each having a photoelectric conversion element and a field-effect transistor are arranged, and a peripheral circuit section for the image pickup pixel section, an interconnect layer driving the field-effect transistor in the image pickup pixel section being formed on a first surface side of a semiconductor substrate, a light receiving surface of the photoelectric conversion element being located on a second surface side of the semiconductor substrate, the solid-state image pickup device further comprising a first terminal exposed from the second surface side of the semiconductor substrate, and a second terminal formed on the first surface side of the semiconductor substrate and electrically connected to the first terminal and the interconnect layer;
• a lens which condenses incident light on the light receiving surface of the photoelectric conversion element;
• a member having the first surface side of the semiconductor substrate mounted on one surface of the member and an external connection terminal provided on the other surface of the member;
• and
• an interconnect formed on the member so as to extend from the one surface side on which the semiconductor substrate is mounted to the other surface side, the interconnect being electrically connected to the external connection terminal.