Solid state imaging apparatus and method for fabricating the same
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsMitsuyoshi MORI, Mikiya Uchida, Kazuo Fujiwara, Takumi Yamaguchi
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AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsMitsuyoshi MORI, Mikiya Uchida, Kazuo Fujiwara, Takumi Yamaguchi
Estimating the term…
A semiconductor device of the present invention includes a substrate; an imaging region which is formed at part of the substrate and in which photoelectric conversion cells including photoelectric conversion sections are arranged in the form of an array; a control-circuit region which is formed at part of the substrate and in which the imaging region is controlled and a signal from the imaging region is outputted; and a copper-containing interconnect layer formed above the substrate and made of a material containing copper. Furthermore, a first anti-diffusion layer and a second anti-diffusion layer are formed, as anti-diffusion layers for preventing the copper from diffusing into each photoelectric conversion section, on the photoelectric conversion section and the copper-containing interconnect layer, respectively.
1-22. (canceled)
A solid state imaging apparatus comprising:
Dependencies are inferred from the claim text.