Chip-type led and method of manufacturing the same
AssigneeSharp Kabushiki Kaisha
InventorMakoto MATSUDA
Life of this patent
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Abstract
An embodiment of the present invention has an insulating substrate in which a first concave hole for mounting an LED chip and a second concave hole for connecting a metallic small-gauge wire are formed, where a metallic sheet that serves as a first wiring pattern is formed at a portion that includes the first concave hole, a metallic sheet that serves as a second wiring pattern is formed at a portion that includes the second concave hole, an LED chip is mounted upon the metallic sheet inside the first concave hole, the LED chip is electrically connected to the metallic sheet inside the second concave hole via a metallic small-gauge wire, and the chip-type LED is sealed with a clear resin.
Claims7
A chip-type LED having an insulating substrate in which a first concave hole for mounting an LED chip and a second concave hole for connecting a metallic small-gauge wire are formed, wherein a metallic sheet that serves as a first wiring pattern is formed at a portion that includes the first concave hole, a metallic sheet that serves as a second wiring pattern is formed at a portion that includes the second concave hole, an LED chip is mounted upon the metallic sheet inside the first concave hole, the LED chip is electrically connected to the metallic sheet inside the second concave hole via a metallic small-gauge wire, and the chip-type LED is sealed with a clear resin.
A method of manufacturing a chip-type LED, comprising the steps of
- forming metallic sheets on the front surface and rear surface of an insulating substrate;
- removing the metallic sheet at an LED chip mounting position and a metallic small-gauge wire connecting position on the front surface side of the insulating substrate;
- forming concave holes having sloped surfaces through a laser process in the regions from which the metallic sheet has been removed, at depths so that they extend to the metallic sheet on the rear surface of the insulating substrate;
- forming a plate layer so as to extend across the side surfaces of the concave holes and the bottom surface of the metallic sheet;
- forming a layer including Au on the front surface of the plate layer through vapor deposition;
- forming an insulating region;
- mounting an LED chip to the bottom surface of one of the concave holes;
- electrically connecting the LED chip to the bottom surface of the other concave hole using a metallic small-gauge wire;
- and
- sealing the LED chip and the metallic small-gauge wire in a resin mold.
Dependencies are inferred from the claim text.