Solder alloys
OwnerAinissa Gweneth Ramirez, Roger Sintainventors
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Abstract
Lead-free solder compositions for bonding and sealing flat panel displays, CCD's, solar cells, light emitting diodes, and other optoelectronic devices are disclosed. The solders are based on alloys of Sn, Au, Ag, and Cu and one or more rare earth metals chosen from the following, Y, La, Ce, Pr, Sc, Sm, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu. Optionally, the compositions may comprise In, Bi, or Zn. The solder compositions exhibit superior bonding capability in joining dissimilar surfaces such as those present in both the flat panel display and light emitting devices. Additionally the solders provide a strong barrier to the diffusion of both water and oxygen into these devices thus promoting longer device life times.
Claims16
A solder alloy comprising:
- a. 0.1-99% by weight of tin,
- b. 0.1-5% by weight of copper,
- c. 0.1-90% by weight of an element selected from the group consisting of silver and gold,
- d. 0.1-5% by weight of an element selected from the group consisting of yttrium, lanthanum, cerium, praseodymium, scandium, samarium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium, and lutetium.
A solder alloy comprising:
- a. 30-98% by weight indium,
- b. 0.5-60% by weight of an element selected from the group consisting of silver and tin,
- c. 0.01-5% by weight of at least one rare earth element elected from the group consisting of yttrium, lanthanum, cerium, praseodymium, scandium, samarium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium, and lutetium,
- wherein the solder alloy is substantially free of titanium, zirconium, hafnium, vanadium, niobium, and tantalum.
Dependencies are inferred from the claim text.