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US 2009/0014739 A1Published application
Light-emitting diode package structure
AssigneeEverlight Electronics Co., Ltd.
InventorsJen-Ta Chiang, Yi-Tsuo Wu, Chia-Hsien Chang, Hsiao-Chiao Li
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Abstract
The present invention is an improved Light-Emitting Diode (LED) package structure comprising a light-emitting diode chip, a package board of heat conductive semiconductor material, a lead frame, and a circuit. Whereon the package board installs plural thermal vias to conduct the electricity circuit and transmit the heat out of the package due to the LED luminescing as well.
Claims8
An improved Light-Emitting Diode (LED) package structure, comprising:
- an LED chip;
- a silicon-containing package substrate, having a pit for placing the LED chip;
- a conductive stand, exposed in the pit and electrically connected to the LED chip;
- and
- a thermal via, passing through the silicon-containing package substrate within the pit area.
2 more elements
An improved Light-Emitting Diode (LED) package structure, comprising:
- an LED chip;
- a gallium arsenic package substrate, having a pit for placing the LED chip;
- a conductive stand, exposed in the pit and electrically connected to the LED chip;
- and
- a thermal via, passing through the gallium arsenic package substrate within the pit area.
2 more elements
Dependencies are inferred from the claim text.