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US 2009/0014735 A1Published application
Semiconductor device and semiconductor device fabrication method
AssigneeShinko Electric Industries Co., Ltd.
InventorsMitsutoshi Higashi, Kei Murayama, Akinori Shiraishi, Yuichi Taguchi
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Abstract
There is provided a semiconductor device in which a light emitting element is mounted on a substrate, having a bonding wire which is connected to the light emitting element, and a through electrode which is connected to the bonding wire and is formed in such a manner as to pass through the substrate at a position lying directly below a connecting portion with the bonding wire.
Claims12
A semiconductor device comprising:
- a substrate;
- a light emitting element mounted on the substrate;
- a bonding wire connected to the light emitting element;
- and
- a through electrode connected to the bonding wire and is formed in such a manner as to pass through the substrate.
2 more elements
A method for fabricating a semiconductor device in which a light emitting element is mounted on a substrate, comprising:
- an electrode forming step of forming a through electrode which passes through the substrate;
- a placing step of placing the light emitting element on the substrate;
- and
- a wiring step for connecting the light emitting element with a side of the through electrode which corresponds to the light emitting element through wire bonding.
1 more element
Dependencies are inferred from the claim text.