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US 2009/0014683 A1Published application
Selective polish for fabricating electronic devices
OwnerLiming Zhang, Uday Mahajaninventors
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Abstract
A selective polish for fabricating electronic devices is disclosed. The selective polish may include the use of a slurry that facilitates the selective polish of a first component but does not substantially polish a second component.
Claims6
A polish composition, comprising:
- a slurry;
- and
- a benzyltrimethylammonium hydroxide (BTMAH) additive to provide the slurry with a poly/oxide selectivity equal to or greater than 5 to 1 (5:1).
Dependencies are inferred from the claim text.