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US 2009/0014527 A1Published application
Ask-026
AssigneeAsk S.A.
InventorsYannick GRASSET, Nicolas Pangaud, Christophe Halope
Life of this patent
Estimating the term…
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AssigneeAsk S.A.
InventorsYannick GRASSET, Nicolas Pangaud, Christophe Halope
Estimating the term…
The invention concerns a method for connecting an electronic chip (10) to contacts (47 and 48) of an electric circuit and designed to receive the chip, the chip being provided with two conductive plates (31 and 32) located on the last layer making up the chip and at least one electromagnetic shielding layer, at least one of the plates (31 or 32) being entirely covered with an electrically insulating layer (34), the method including the following steps: Placing an adhesive dielectric material (40) on the circuit between the contacts (47, 48), so as to maintain the electronic chip (10) in a fixed position relative to the circuit, Positioning the electronic chip (10) on the circuit so that the conductive plates (31 et 32) are opposite the contacts (47 and 48) of the electric circuit, so as to create between the chip and the electric circuit at least one capacitive link made up of the conductive plate (31 or 32), the electrically insulating layer completely covering said plate and the contact (47 or 48).
1-12. (canceled)
A method for connecting an electronic chip to contacts of an electric circuit designed to receive said chip, said chip being provided with two conductive plates located on the last layer making up the chip and at least one electromagnetic shielding layer, at least one of the plates being entirely covered by an electrically insulating layer, said method comprising the following steps:
A card or label radiofrequency identification device comprising an electronic chip and an antenna equipped with two contacts, said chip comprising two conductive plates located on the last layer making up the chip, at least one of the plates being entirely covered with an electrically insulating layer, said chip being maintained in a fixed position between the contacts by means of an adhesive dielectric material and being positioned on the device so that said conductive plates are opposite the contacts and so as to create at least on capacitive link between the chip and the antenna, the link comprising the conductive plate, the electrically insulating layer entirely covering said plate and the contact.
Dependencies are inferred from the claim text.