Method of Supplying Paste Solder Material and Metal Mask Therefor
AssigneeHitachi, Ltd.
InventorsAkira Kamisaka, Kaoru Katayama
Life of this patent
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Abstract
When different paste solder materials are printed to circuit patterns on a substrate, a plurality of metal masks corresponding to kinds of solder materials are used so as to perform printing in a manner corresponding to each of the solder materials, so that the particular solder materials are supplied to particular components in the same flat surface. One of the metal mask is provided with a depression so that the mask does not contact the solder material which has already been printed, and the metal mask is further provided with another depression to reduce an amount of the solder material supplied.
Claims9
A method of supplying a paste solder material to solder a component to a circuit pattern on a substrate, comprising:
- supplying, onto the same surface, optimum amounts of different solder materials corresponding to kinds of components by use of a metal mask to perform printing.
Dependencies are inferred from the claim text.