Reflow apparatuses and methods for reflow
AssigneeSamsung Electronics Co., Ltd.
InventorsJae-Hoon Choi, Seong-Chan Han, Se-Hyung Ryu, Nam-Yong Oh
Life of this patent
Estimating the term…
Abstract
There are provided reflow apparatuses and a methods therefor. In some embodiments, a reflow apparatus includes a first heating unit capable of heating a solder on a substrate up to just below before a melting point of the solder at ambient pressure such that the solder on the substrate is melted and electronic components mounted on the substrate are then soldered to the substrate; and a second heating unit connected to the first heating unit, the second heating unit capable of heating the solder on the substrate heated in the first heating unit through at least a portion of a solder melting temperature range in a vacuum state.
Claims24
A reflow apparatus comprising:
- a first heating unit capable of heating a solder on a substrate up to just below a melting point of the solder at ambient pressure such that the solder on the substrate is melted and electronic components mounted on the substrate are soldered on the substrate;
- and
- a second heating unit connected to the first heating unit, the second heating unit capable of heating the solder on the substrate heated in the first heating unit through at least a portion of a solder melting temperature range in a vacuum state.
A reflow apparatus comprising:
- a first heating unit including a heater for heating an ambient gas and a fan for sending the ambient gas heated by the heater, the first heating unit capable of heating a solder on a substrate up to just below a melting point of the solder by means of hot gas or wind using a convection method such that the solder on the substrate is melted and electronic components mounted on the substrate are then soldered to the substrate;
- and
- a second heating unit connected to the first heating unit and including a heater for producing radiation heat, the second heating unit heating the solder on the substrate heated in the first heating unit through at least a portion of a solder melting temperature range by means of heat radiation using a non-contact method.
A reflow method for melting a solder on a substrate, thereby soldering electronic components mounted on the substrate, comprising:
- first heating the solder on the substrate up to just below a melting point of the solder at ambient pressure using a first heating unit;
- and
- second heating the solder on the substrate heated in the first heating unit through at least a portion of a solder melting temperature range in a vacuum state using a second heating unit connected to the first heating unit and provided with a vacuum pump.
A reflow method for melting a solder on a substrate, thereby soldering electronic components mounted on the substrate, comprising:
- first heating the solder on the substrate up to just below a melting point of the solder with a first heating unit by means of convection, the first heating unit including a heater for heating an ambient gas and a fan capable of sending the ambient gas heated by the heater to the solder;
- and
- second heating the solder on the substrate through at least a portion of a solder melting temperature range with a second heating unit by heat radiation using a non-contact method, the second heating unit including a heater for heat radiation connected to the first heating unit to produce radiation heat.
Dependencies are inferred from the claim text.