Electronic component mounting system, electronic component placing apparatus, and electronic component mounting method

An electronic component placing apparatus which mounts on a board an electronic component having plural solder bumps for external connection on the lower surface, comprising:

• a board positioning part which positions the board having electrodes on which the solder paste has been printed in the previous step;
• a component placing mechanism which places the electronic component by a loading head on the board on which the solder paste has been printed;
• a solder paste supply part which transfer-coats the solder bumps of the electronic component with the solder paste;
• and
• a solder paste transfer necessity judging means which judges, on the basis of the measurement results of the height positions of the solder paste printed on the electrodes in the previous step, whether or not the transfer of the solder paste to the solder bumps by the solder paste supply part is necessary.

An electronic component mounting method of mounting on a aboard an electronic component by solder-joint by means of an electronic component system constituted by coupling plural apparatuses for electronic component mounting, comprising:

• a printing step of printing solder paste on electrodes for electronic component joint which are formed on the board by a printing apparatus;
• a measurement step of executing three-dimensional measurement for the post-print board thereby to measure the height position of the printed solder paste;
• an electronic component mounting step of picking up an electronic component from a component supply part by a loading head and mounting the electronic component on the board on which the solder paste has been printed;
• and
• a reflow step of heating the board on which the electronic component has been mounted thereby to heat and melt the solder bumps and the solder paste, and solder-joining the electronic component onto the board,
• wherein, on the basis of the measurement result of the height of the solder paste, whether or not the transfer of the solder paste to the solder bumps by the solder paste supply part is necessary is judged;
• and in case that it is judged that the transfer is necessary, the transfer of the solder paste onto the solder bumps is executed, and thereafter the electronic component is mounted on the board.