Transparent textured substrate and methods for obtaining same

2:

• A process according to claim 1, wherein the mask comprises an electrically conductive material.

3:

• A process according to claim 1, wherein the mask is placed in contact with the layer to be etched during etching.

4:

• A process according to claim 1, wherein the mask does not contact the layer to be etched during etching.

5:

• A process according to claim 1, wherein the mask is supported by a sheet during etching.

6:

• A process according to claim 1, wherein the layer to be etched is laminated with an underlying electrically conductive layer, which is polarized with a radiofrequency generator during etching.

7:

• A process according to claim 1, wherein the substrate is placed on an electrically conductive support connected to a radiofrequency generator during etching.

8:

• A process according to claim 1, wherein the layer to be etched is itself electrically conductive.

9:

• A process according to claim 1, wherein the layer to be etched is laminated with a sheet of electrically conductive glass.

10:

• A process according to claim 1, wherein the layer to be etched is laminated with a sheet of glass provided on its opposite face with an electrically conductive layer.

11:

• A process according to claim 1, wherein one or more plasmagenic gases is used.

12:

• A process according to claim 1, wherein the mask is composed of nodules comprising at least one of the element selected from the group consisting of Ag, Au, Pd, Pt, Cu, Al, Zn, Sn, Sb, Ti, Zr, W, Mb, Ta, and Ir.

13:

• A process according to claim 1, further comprising a step in which a fraction of the said mask remaining after completion of etching is eliminated or transformed to transparent compounds.

14:

• A process according to claim 1, further comprising a step in which a coating is formed on the substrate after completion of etching, after which, optionally, a fraction of the mask remaining after completion of etching is eliminated or transformed.