Compositions and methods for rapidly removing overfilled substrates

A method of chemical mechanical polishing of a substrate comprising the steps of:

• A) providing a substrate having a surface comprising copper disposed over a predominately dielectric layer;
• B) movably contacting the substrate with a chemical-mechanical-polishing composition under conditions where at least a portion of the copper is removed, wherein the chemical-mechanical-polishing composition comprises:
• a) an oxidizer selected from the group consisting of a peroxide, periodic acid, peracetic acid, and ammonium persulfate, wherein the oxidizer forms free radicals;
• b) water,
• c) an amine-containing film-forming agent, and
• d) at least one non-chelating free radical quencher selected from an hydroxyl-containing amine, a polyol compound, an unsaturated cycloalkene having more than one carbon-carbon double bond, a diazene compound, an azobenzene compound, humic acid, and/or derivatives and salts thereof,
• with the proviso that the at least one non-chelating free radical quencher is not ascorbic acid, isopropanol, thiamine, or a glycol compound, and that the non-chelating free radical quencher is not the amine-containing film-forming agent, and
• wherein the amount of the non-chelating free radical quencher is sufficient to reduce the amount of corrosion of the polished copper surface.