Acidic gold alloy plating solution
AssigneeRohm and Haas Electronic Materials LLC
InventorsYutaka Morii, Masanori Orihashi
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Abstract
A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents.
Claims7
An acidic gold alloy plating solution containing gold cyanide or salt thereof, cobalt ions, chelating agent, hexamethylene tetramine, and a glossing agent, wherein the glossing agent of said plating solution is a nitrogen atom containing compound with a carboxyl group or a hydroxyl group, or a sulfur atom containing compound with a carboxyl group.
A method of forming a gold alloy plating film by electrolytic plating, using an acidic gold alloy plating solution containing gold cyanide or salt thereof, cobalt ions, chelating agent, hexamethylene tetramine, and a nitrogen atom containing compound with a carboxyl group or a hydroxyl group, or a sulfur atom containing compound with a carboxyl group.
A method of manufacturing a connector formed with a gold alloy plating film, comprising:
- performing nickel plating on the contact region of the connector;
- and performing gold alloy plating on the nickel film;
- wherein said gold alloy plating is electrolytic plating using an acidic gold alloy plating solution containing gold cyanide or salt thereof, cobalt ions, chelating agent, hexamethylene tetramine, and a nitrogen atom containing compound with a carboxyl group or a hydroxyl group, or a sulfur atom containing compound with a carboxyl group.
Dependencies are inferred from the claim text.