Printed circuit board assembled panel, unit sheet for packaging a printed circuit board, rigid-flexible board and method for manufacturing the same
AssigneeDai Nippon Printing Co., Ltd.
InventorsAtsushi Kobayashi, Kazuo Umeda, Wataru Gotou, Takahiro Sahara, Susumu Nakazawa, Kiyoshi Takeuchi, Takayuki Terauchi
Life of this patent
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Abstract
A method for manufacturing a printed circuit board assembled panel by a simple process with an excellent material yield and a high conforming product rate. Unit printed circuit boards previously manufactured are arranged in a frame in a prescribed relationship. Then, the printed circuit boards are fixed to one another, and the printed circuit board and the frame body are fixed to one another.
Claims13
1-27. (canceled)
A rigid-flexible board wherein a rigid board and a flexible board are laminated integrally via an insulating layer so that a vertical circuit area penetrating through said insulating layer can connect electrically horizontal circuit areas of said rigid board and said flexible board,
- wherein said rigid board is a multilayered circuit rigid board with three or more circuit layers, and said vertical circuit area is a conductive bump which is positioned at said horizontal circuit area of said flexible board and which is pressed against said horizontal circuit area of said flexible board so that the forefront of said conductive bump is plastic-deformed through said insulating layer;
- and
- wherein said flexible board is exposed to an outer layer.
A rigid-flexible board wherein a rigid board and a flexible board are laminated integrally via an insulating layer so that a vertical circuit area penetrating through said insulating layer can connect electrically horizontal circuit areas of said rigid board and said flexible board,
- wherein said rigid board is a multilayered circuit rigid board with three or more circuit layers, and said vertical circuit area is a laser skip via including a hole formed by means of the irradiation of laser beam for said flexible board and said insulating layer so that a horizontal circuit area of said rigid board is exposed and a conductive layer applied onto the inner wall of said hole;
- and
- wherein said flexible board is exposed to an outer layer.
A rigid-flexible board wherein a rigid board and a flexible board are laminated integrally via an insulating layer so that a vertical circuit area penetrating through said insulating layer can connect electrically horizontal circuit areas of said rigid board and said flexible board,
- wherein said rigid board is a multilayered circuit rigid board with three or more circuit layers, said vertical circuit area is an electrical conductor including a through hole which is formed at said insulating layer commensurate with said horizontal circuit areas of said rigid board and said flexible board and a conductive material filled in said through hole;
- and
- wherein said flexible board is exposed to an outer layer.
A method for manufacturing a rigid-flexible board wherein a rigid board and a flexible board are laminated integrally via an insulating layer so that a vertical circuit area penetrating through said insulating layer can connect electrically horizontal circuit areas of said rigid board and said flexible board, comprising the steps of:
- preparing a multilayered circuit rigid board with a conductive bump constituting said vertical circuit area which is positioned at said horizontal circuit area formed at an outer layer;
- laminating a thermal melting resin sheet under non-hardening condition on said multilayered circuit rigid board over said conductive bump;
- thermally pressing said thermal melting resin sheet so that the forefront of said conductive bump is exposed through said thermal melting resin layer;
- preparing said flexible board with a connector and said horizontal circuit area which are formed at an outer surface of said flexible board so that said connector is connected with said horizontal circuit area and corresponds to said vertical circuit area, at least a portion of said flexible board being covered with a protective film;
- and
- laminating said rigid board and said flexible board through thermal pressing so that said conductive bump is opposite to said connector and the forefront of said conductive bump is plastic-deformed through said insulating layer.
A method for manufacturing a rigid-flexible board wherein a rigid board and a flexible board are laminated integrally via an insulating layer so that a vertical circuit area penetrating through said insulating layer can connect electrically horizontal circuit areas of said rigid board and said flexible board, comprising the steps of:
- preparing said flexible board with a conductive bump constituting said vertical circuit area and said horizontal circuit area which are formed at an outer surface of said flexible board so that said conductive bump is connected with said horizontal circuit area, at least a portion of said flexible board being covered with a protective film;
- laminating a thermal melting resin sheet under non-hardening condition on said flexible board over said conductive bump;
- preparing a multilayered circuit rigid board with a connector and said horizontal circuit area which are formed on an outer surface of said rigid board so that said connector is positioned commensurate with said vertical circuit area of said flexible board;
- thermally pressing said thermal melting resin sheet so that the forefront of said conductive bump is exposed through said thermal melting resin layer;
- and laminating said rigid board and said flexible board through thermal pressing so that said conductive bump is opposite to said connector and the forefront of said conductive bump is plastic-deformed through said insulating layer.
A method for manufacturing a rigid-flexible board wherein a rigid board and a flexible board are laminated integrally via an insulating layer so that a vertical circuit area penetrating through said insulating layer can connect electrically horizontal circuit areas of said rigid board and said flexible board, comprising the steps of:
- preparing said flexible board with said horizontal circuit area which is formed at an outer layer of said flexible board, at least a portion of said flexible board being covered with a protective film;
- preparing a multilayered circuit rigid board with a connector and said horizontal circuit area which are formed on an outer surface thereof so that said connector is positioned for electrically connecting said flexible board;
- laminating said insulating layer made of a thermal melting resin under non-hardening condition on said multilayered circuit rigid board over said connector;
- laminating said flexible board on said rigid board via said insulating layer so that the horizontal circuit area of said flexible board is faced outside through thermal pressing;
- irradiating a laser beam for said flexible board and said insulating layer to form a through hole to expose said connector of said rigid board through said flexible board and said insulating layer;
- and
- forming a conductive layer at the inner wall of said through hole to form a laser skip via constituting said vertical circuit area,
- wherein said rigid board and said flexible board are combined electrically with one another via said laser skip via.
A method for manufacturing a rigid-flexible board wherein a rigid board and a flexible board are laminated integrally via an insulating layer so that a vertical circuit area penetrating through said insulating layer can connect electrically horizontal circuit areas of said rigid board and said flexible board, comprising the steps of:
- preparing said flexible board with said horizontal circuit area and a connector which are formed at an outer layer of said flexible board so that said connector is positioned at the connection between said rigid board and said flexible board via said vertical circuit area, at least a portion of said flexible board being covered with a protective film;
- preparing a multilayered circuit rigid board with said horizontal circuit area and a connector which are formed at an outer layer thereof so that said connector is positioned at the connection between said rigid board and said flexible board via said vertical circuit area;
- forming, on said rigid board and/or said flexible board, a thermal melting insulating layer with a conductive body made of a through hole positioned commensurate with said connector and a conductive material filled in said through hole;
- and
- laminating said rigid board and said flexible board through thermal pressing so that said conductive body is opposite to said connector and said conductive body is contacted electrically with said connector.
Dependencies are inferred from the claim text.