C4np compliant solder fill head seals

A fill head for placing conductive bonding material into a plurality of cavities in a mold, the fill head comprising:

• a seal support groove situated on a bottom surface, wherein the seal support groove includes:
• a first side wall;
• a second side wall;
• at least one horizontal upper wall situated above at least one of the first side wall and the second side wall;
• and
• a seal situated within the seal support groove, wherein the seal includes:
• a first outer wall, wherein the first vertical outer wall is configured to abut the first side wall of the seal support groove;
• a second outer wall, wherein the second outer wall is configured to abut the second side wall of the seal support groove;
• and
• a contact surface extending downward from the first outer wall and the second outer wall, wherein the contact surface portion is configured to cooperate with a top surface of a mold.

A system for placing conductive bonding material into a plurality of cavities in a mold, the system comprising:

• a controller;
• a mold comprising a plurality of cavities;
• and
• a fill head for depositing conductive bonding material on the mold, wherein the fill head comprises:
• a seal support groove situated on a bottom surface, wherein the seal support groove includes a first side wall, a second side wall, at least one horizontal upper wall situated above at least one of the first side wall and the second side wall;
• and
• a seal situated within the seal support groove, wherein the seal includes, a first outer wall, wherein the first outer wall is configured to abut the first wall of the seal support groove, a second outer wall, wherein the second outer wall is configured to abut the second side wall of the seal support groove, and a contact surface extending downward from the first outer wall and the second outer wall, wherein the contact surface portion is configured to cooperate with a top surface of a mold.